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1、常用半导体中英文对照表离子注入机ionimplanter1.SS理论LindhandScharffandSchiotttheory,又称林汉德-斯卡夫-斯高特理论。沟道效应channelingeffect射程分布rangedistribution深度分布depthdistribution投影射程projectedrange阻止距离stoppingdistance阻止本领stoppingpower标准阻止截面standardstoppingcrosssection退火annealing激活能activationenergy等温退火isothermalannealing激光退火laserannea
2、ling应力感生缺陷stress-induceddefect择优取向preferredorientation制版工艺mask-makingtechnology图形畸变patterndistortion初缩firstminification精缩finalminification母版mastermask铭版chromiumplate干版dryplate乳胶版emulsionplate透明版see-throughplate高分辨率版highresolutionplate,HRP超微粒干版plateforuItra-microminiaturization掩模mask掩模对准maskalignment
3、对准精度alignmentprecision光刻胶PhotOreSiSt,又称光致抗蚀剂负性光刻胶negativephotoresist正性光刻胶positivephotoresist无机光刻胶inorganicresist多层光刻胶multilevelresist电子束光刻胶electronbeamresistX射线光刻胶X-rayresist刷洗scrubbing甩胶spinning涂胶photoresistcoating光亥IJphotolithographyX射线光刻X-raylithography电子束光刻electronbeamlithography离子束光刻ionbeamlith
4、ography深紫外光刻deep-UVlithography光刻机maskaligner投影光刻机projectionmaskaligner曝光exposure接触式曝光法contactexposuremethod接近式曝光法proximityexposuremethod光学投影曝光法opticalprojectionexposuremethod电子束曝光系统electronbeamexposuresystem分步重复系统step-and-repeatsystem显影development线宽linewidth去胶strippingofphotoresist氧化去胶removingofphot
5、oresistbyoxidation等离子体去胶removingofphotoresistbyplasma刻蚀etching干法刻蚀dryetching反应离子刻蚀reactiveionetching,RIE各向同性刻蚀isotropicetching各向异性刻蚀anisotropicetching反应溅射刻蚀reactivesputteretching离子铳ionbeammilling,又称离子磨削等离子体刻蚀plasmaetching剥离技术Iift-OffteChnOIOgy,又称浮脱工艺。终点监测endpointmonitoring金属化metallization互连interconn
6、ection多层金属化multilevelmetallization电迁徙electromigration回流reflow磷硅玻璃phosphorosilicateglass硼磷硅玻璃boron-phosphorosilicateglass钝化工艺passivationtechnology多层介质钝化multilayerdielectricpassivation划片scribing电子束切片electronbeamslicingE压indentation热压焊thermocompressionbonding热超声焊thermosonicbonding冷焊coldwelding点焊spotwel
7、ding球焊ballbonding楔焊wedgebonding内弓I线焊接innerleadbonding外引线焊接OUterleadbonding梁式引线beamlead装架工艺mountingtechnology附着adhesion封装packaging金属封装metallicpackaging陶瓷封装ceramicpackaging扁平封装flatpackaging塑封plasticpackage玻璃封装glasspackaging微封装micropackaging,又称微组装。管壳package管芯die引线键合leadbonding引线框式键合Ieadframebonding带式自动
8、键合tapeautomatedbonding,TAB激光键合IaSerbonding超声键合ultrasonicbonding红外键合infraredbondingEDA365电子论坛微电子辞典大集合（按首字母顺序排序）Abruptjunction突变结Acceleratedtesting加速实验Acceptor受主Acceptoratom受主原子Accumulation积累、堆积Accumulatingcontact积累接触Accumulationregion积累区Accumulationlayer积累层Activeregion有源区Activecomponent有源元Activedevic
9、e有源器件Activation激活Activationenergy激活能Activeregion有源(放大)区Admittance导纳Allowedband允带Alloy-junctiondevice合金结器件AIuminum(AIuminium)铝Aluminum-oxide铝氧化物Aluminumpassivation铝钝化Ambipolar双极的Ambienttemperature环境温度Amorphous无定形的，非晶体的Amplifier功放扩音器放大器AnaIogue(AnaIog)comparator模拟比较器Angstrom埃Anneal退火Anisotropic各向异性的An
10、ode阳极Arsenic(AS)碑Auger俄歇Augerprocess俄歇过程Avalanche雪崩Avalanchebreakdown雪崩击穿Avalancheexcitation雪崩激发BBackgroundcarrier本底载流子Backgrounddoping本底掺杂Backward反向Backwardbias反向偏置Ballastingresistor整流电阻Ballbond球形键合Band能带Bandgap能带间隙Barrier势垒Barrierlayer势垒层Barrierwidth势垒宽度Base基极Basecontact基区接触Basestretching基区扩展效应Bas
11、etransittime基区渡越时间Basetransportefficiency基区输运系数Base-widthmodulation基区宽度调制Basisvector基矢Bias偏置Bilateralswitch双向开关Binarycode二进制代码Binarycompoundsemiconductor二元化合物半导体Bipolar双极性的BipolarJunctionTranSiStOr(BJT)双极晶体管Bloch布洛赫Blockingband阻挡能带Blockingcontact阻挡接触Body-centered体心立方Body-centredcubicstructure体立心结构Bo
12、ltzmann波尔兹曼Bond键、键合Bondingelectron价电子Bondingpad键合点Bootstrapcircuit自举电路Bootstrappedemitterfollower自举射极跟随器Boron硼Borosilicateglass硼硅玻璃Boundarycondition边界条件Boundelectron束缚电子Breadboard模拟板、实验板Breakdown击穿Breakover转折Brillouin布里渊Brillouinzone布里渊区Built-in内建的Build-inelectricfield内建电场Bulk体/体内Bulkabsorption体吸收Bu
13、lkgeneration体产生Bulkrecombination体复合Burn-in老化Burnout烧毁Buriedchannel埋沟Burieddiffusionregion隐埋扩散区CCan外壳Capacitance电容Capturecrosssection俘获截面Capturecarrier俘获载流子Carrier载流子、载波Carrybit进位位Carry-inbit进位输入Carry-outbit进位输出Cascade级联Case管壳Cathode阴极Center中心Ceramic陶瓷（的）Channel沟道Channelbreakdown沟道击穿Channelcurrent沟道电
14、流Channeldoping沟道掺杂Channelshortening沟道缩短Channelwidth沟道宽度Characteristicimpedance特征阻抗Charge电荷、充电Charge-compensationeffects电荷补偿效应Chargeconservation电荷守恒Chargeneutralitycondition电中性条件Chargedrive/exchange/sharing/transfer/storage电荷驱动/交换/共享/转移/存储Chemmicaletching化学腐蚀法Chemically-Polish化学抛光Chemmically-MechanicallyPolish(CMP)化学机械抛光Chip芯片Chipyield芯片成品率Clamped箝位Clampingdiode箝位二极管Cleavageplane解理面Clockrate时钟频率Clockgenerator时钟发生器Clockflip-flop时钟触发器Close-packedstructure密堆积结构Close-loopgain闭环增益Collector集电极Collision碰撞CompensatedOP-AMP补偿运放Common-
